Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure
Company Description About Grab and Our Workplace Grab is Southeast Asias leading superapp. From getting your favourite meals delivered to helping you manage your finances and getting around town hassle-free, weve got your back with everything.
Wood Mackenzie is the global leader in analytics, insights and proprietary data across the entire energy and natural resources landscape. For over 50 years our work has guided the decisions of the world’s most influential energy
Work location: The Vertical Business Suite, Bangsar South., Malaysia Working time: Mon - Fri 9:00 am - 6:00 pm, work at the office 100% Design, develop, and maintain scalable mobile applications for both smartphones and tablets, ensuring
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
Selangor, Malaysia Job Family Group:Production Engineering Upstream Worker Type:Regular Posting Start Date:July 1, 2026 Business Unit:Projects and Technology Experience Level: Experienced Professionals Job Description: What’s the role The Well Reservoir Facilities Management (WRFM) delivery engine in
Job Description We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing
Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications,
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure
Work location: The Vertical Business Suite, Bangsar South., Malaysia Working time: Mon - Fri 9:00 am - 6:00 pm, work at the office 100% Key Responsibilities Design, develop, and maintain scalable mobile applications for both smartphones and
Who is sa.global sa.global addresses industry challenges through vertical-focussed solutions. Leveraging modern technologies like AI and Copilot, we empower organizations to make intelligent decisions and act faster. Our solutions and services are 100% based on Microsoft business
Role Overview We are seeking a Technical Lead to lead the design and delivery of a new product vertical: visitor identity resolution and data enrichment, built on top of tawk.tos customer engagement platform. This person will own
Work location: The Vertical Business Suite, Bangsar South., Malaysia Working time: Mon - Fri 9:00 am - 6:00 pm, work at the office 100% Key Responsibilities Execute manual test cases and report defects with clear documentation. Perform